Semiconductor Wafer Bonding: Science and Technology

By Q.-Y. Tong, U. Gösele, Q.-Y. Tong

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Bonding - eine Technik zum "Verschwei en" von Halbleiter-Wafers ohne "Klebstoff" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur W?rmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01/99)

Format:Hardcover

Language:English

ISBN:0471574813

ISBN13:9780471574811

Release Date:November 1998

Publisher:Wiley-Interscience

Length:320 Pages

Weight:1.30 lbs.

Dimensions:0.8" x 6.0" x 9.6"

Related Subjects

Chemical Chemistry Clinical Chemistry Electrical & Electronics Electrochemistry Engineering Internal Medicine Medicine Physical & Theoretical Physics Science Science & Math Science & Scientists Science & Technology Solid-State Physics Technology

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Semiconductor Wafer Bonding: Science and Technology

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